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PAL16L8AM, PAL16L8A-2M, PAL16R4AM, PAL16R4A-2M PAL16R6AM, PAL16R6A-2M, PAL16R8AM, PAL16R8A-2M STANDARD HIGH-SPEED PAL® CIRCUITS SRPS016– D2705, FEBRUARY 1984– REVISED MARCH 1992

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package DEVICE PAL16L8 PAL16R4 PAL16R6 PAL16R8 I INPUTS 10 8 8 8 3-STATE O OUTPUTS 2 0 0 0 REGISTERED Q OUTPUTS 0 4 (3-state buffers) 6 (3-state buffers) 8 (3-state buffers) I/O PORT S 6 4 2 0

PAL16L8’ J OR W PACKAGE (TOP VIEW)

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description These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allow for quick design of”custom” functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space. The Half-Power versions offer a choice of operating frequency, switching speeds, and power dissipation. In many cases, these Half-Power devices can result in significant power reduction from an overall system level. The PAL16’ M series is characterized for operation over the full military temperature range of–55°C to 125°C.

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I I I VCC O I/O I/O I/O I/O I/O Copyright© 1992, Texas Instruments Incorporated

PAL is a registered trademark of Advanced Micro Devices Inc. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

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